MODULE MANUFACTURING

Semiconductors of all leading chip manufacturers are processed by Cardag Deutschland to contact or contactless chip modules in our own housings. We work with dies up to 25mm².area. 

The used base material is an epoxy-glass compound.

Cardag Deutschland is qualified module manufacturer for Atmel Inc.

Our special service are customer specific chips or application specific bonded dies – please contact us to find a solution that suits your requirements.

Links to semiconductor manufacturers: