Semiconductors of all leading chip manufacturers are processed by Cardag Deutschland to contact or contactless chip modules in our own housings. We work with dies up to 25mm².area.
The used base material is an epoxy-glass compound.
Cardag Deutschland is qualified module manufacturer for Atmel Inc.
Our special service are customer specific chips or application specific bonded dies – please contact us to find a solution that suits your requirements.
Links to semiconductor manufacturers:
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