Cardag use semiconductors of all leading manufacturers to produce contact and contactless smart card modules. We can process dies up to 25mm² area.
Our module tape is an epoxy-glass material.
Cardag Deutschland GmbH is qualified by Atmel in module manufacturing.
We process customer specific dies with special bonding schemes as additional service. Let us know your requirements – we will find a solution.
Links to semiconductor manufacturers:
• NXP (www.nxp.com)
• Infineon (www.infineon.com)
• Atmel (www.atmel.com)