Cardag use semiconductors of all leading manufacturers to produce contact and contactless smart card modules. We can process dies up to 25mm² area.

Our module tape is an epoxy-glass material.

Cardag Deutschland GmbH is qualified by Atmel in module manufacturing.

We process customer specific dies with special bonding schemes as additional service. Let us know your requirements – we will find a solution.

Links to semiconductor manufacturers:

• NXP (www.nxp.com)

• Infineon (www.infineon.com)

• Atmel (www.atmel.com)